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Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine: : Ikeda et al. 4432245: Grinding machine motor with a torque sensor: : Hattori et al. 73/862.321
Prime silicon wafer is hard and brittle material. Due to its properties, double sided lapping machine with ceramic grinding agent were introduced for machining high quality standard silicon wafers. The main focus is the silicon wafer with high accuracy of flatness; to reduce total thickness variation, waviness and roughness.
Double-sided planetary grinding was attempted to put into sapphire substrate lapping. Simulation methods were used to quantify the uniformity of the workpiece surface. The differences of the trajectory distribution on both sides of the workpiece were revealed. High-efficiency precision machining of sapphire can be achieved by this grinding method.
Double disk grinding is like two-sided Blanchard grinding, in that it removes material more quickly than a method such as surface grinding. (Of course, with any abrasive method, material removal speed depends on the …
A kinematic model was established on the basis of the double-sided planetary grinding movement. The double-sided planetary grinding equipment structure is shown in Fig. 1, which consists mainly of an upper and lower plate as well as the sun wheel that rotates around the respective axis.The workpieces are placed in planetary wheels that are driven by the sun …
In a double side simultaneous grinding method, the generation of warpage of the plate-like workpiece is suppressed and degradation of warpage is prevented. Thereby, the plate-like workpiece can be...
Diamond wire multi-wire cutting is used to control warp, bow, and TTV; double-sided grinding is used to remove the cutting damage layer and raise warp, bow, TTV and LTV; double-sided polishing is used to reduce the roughness less than 2nm. Chemical mechanical polishing is used to improve the surface quality, make the roughness＜0.2nm and no ...
Double side grinding is a process with high processing efficiency in which the wheel and the workpiece are in surface contact. But the phenomenon that the workpiece surface profile is out of tolerance exists because of the material removal non-uniformity in the grinding process. In order to improve the surface integrity of the ground workpiece, the mathematical …
Simultaneous double side grinding (SDSG) is one of the processes to flatten the wire-sawn wafers. This paper reviews the literature on SDSG of silicon wafers, covering the history, machine development (including machine configuration, drive and support systems, and control system), and process modeling (including grinding marks and wafer shape).
A. Saitoh, H. Masahiko, Grinding method of vertical type double-head surface grinding machine for machining brake disk, Japanese Patent …
Learn how to use double sided tape as a workholding technique for your CNC Machine.Machine: PRO60120
In theory, the process requires a minimum of three parts. The actual number is determined by part quantity, part size, and machine size. With double-sided lapping and polishing (DSLP), the optical components are held in geared or sprocketed carriers that are driven in a planetary motion covering the full surface of the lapping plates and are subject to continually changing direction …
Holymood Double Sided Cutting Board with Juice Groove, Stainless Steel and Wheat Straw Chopping Board with Handle, Dishwasher Safe, BPA Free, Knife friendly, Grinding Area, 15.7 x 10.6 x 0.79 Inch . Visit the HOLYMOOD Store. 4.1 out of 5 stars 6 ratings. Price: $45.99 $45.99 & FREE Returns .
The grinding spindle of the KRONOS M is mounted on double-sided bea-rings. The roller-bearing grinding spindle is designed for the use of con-ventional grinding wheels up to 63 m/s. Optionally, spindles for the use of superabrasive cutting materials such as CBN or diamond up to 120 m/s can also be used.
Double sided V butt Double sided bevel butt Double sided U butt weld Symbol . Name Fillet Resistance Spot Resistance Steam . Name Finish Weld Symbol on Symbol base platform weld . Consumable insert entirely around Symbol on base platform weld . Name Weld between points Weld on site Staggered
The double-sided lapping machine is mainly used for double-side lapping of crystals or other mechanical parts that are parallel on two sides, especially the processing of thin brittle materials. It is suitable for various materials of mechanical seal ring, ceramic wafer, cylinder piston ring, oil pump blade bearing end face, silicon, germanium ...
METHOD FOR DOUBLE-SIDED LAPPING WORKPIECE, METHOD FOR PRODUCING WORKPIECE, AND DOUBLE-SIDED LAPPING APPARATUS FOR WORKPIECE According to the present invention, the sum and the ratio of the torque of a sun gear and the torque of a internal gear are controlled to be within predetermined ranges. WO/2021/252540A1
Double-sided planetary grinding is a new process for the rapid thinning and flattening of sapphire, and experiments with it were carried out on sapphire substrates with four commonly used crystal ...
JP-2001273683-A chemical patent summary.
Abstract. To achieve high surface flatness of silicon wafer in double-sided polishing (DSP) process, kinematical model of DSP process utilizing accurate friction coefficient between wafer and polishing pad was investigated. On the basis of the proposed analytical model, optimization method of a set of rotation conditions of upper/lower platens ...
Yuan et al. (2021) introduced a chatter-mitigation method by using double-sided supporting system in milling thin-walled parts. However, many thin-walled parts, such as ribs and turbine blades, have complex double-sided features, which require much more machining operations from both sides of the part.
Double Disc Surface Grinding Machine. We designed for high precision grinding of the two paralell surfaces of flat metallic parts such as bearing, valve plate, carbide chip, seal, oil pump vane, piston ring, etc. It can also grind the flat surfaces of non-metallic parts of hard & brittle materials like glass and ceramics.
True to its name, double disk grinding uses two opposing abrasive wheels to grind two sides of a material at the same time. This makes it a very efficient grinding method for achieving a tight tolerance surface finish, flatness, and parallelism in the right applications. Yet there is somewhat of an aura of mystery surrounding double disk grinding.
Double-Disc Grinding is a highly efficient grinding method that reduces pre-machining costs up to 50% and provides dimensional tolerances, parallelism, and flatness up to ±.001″. (For even tighter tolerances, see our Surface Grinding process.) Double-Disc Grinding uses two opposing abrasive wheels to simultaneously grind two sides of the ...
Wafer double - sided grinding method Download PDF Info Publication number TWI390617B. TWI390617B TW095125111A TW95125111A TWI390617B TW I390617 B TWI390617 B TW I390617B TW 095125111 A TW095125111 A TW 095125111A TW 95125111 A TW95125111 A TW 95125111A TW I390617 B TWI390617 B TW I390617B Authority TW Taiwan Prior art …
Crownkyn Superhard GC-2M8470B double-sided grinder can meet the requirements of high precision surface grinding or fine grinding, by removing the excess material on the two surfaces of the parts, can obtain extremely accurate geometric precision and surface finish. Usually, this is the last grinding step in the mechanical production chain to ...
Double-sided polishing process is a precise machining method for silicon wafers.It has the characteristics of the multi-directional motion,the complicated load and the tiny material removal.The wafer… Expand 5 An investigation of the effects of the tool path on the removal of material in polishing H. Tam, Haobo Cheng Materials Science 2010
Double-sided planetary grinding as an efficient and precise machining method is used for the rapid thinning and flattening process of sapphire substrate. As an intermediate processing technology of sapphire substrate preparation procedure, many experiments are carried out to evaluate the lapping effect in the paper. Surface quality, processing efficiency, and surface …
Blanchard Grinding is best suited for single-sided material removal and grinding applications too large for double-disc grinding. Blanchard grinding, also known in the industry as rotary surface grinding, quickly removes stock from one side of a part. Parts with a size of 36″ × 42″ can be Blanchard Ground on our machine.